Hysol Huawei KLG750

Hysol HuaweiKLG750 has superior adhesion technology to ensure zero delamination performance for SOT and SOIC packages. Offers enhanced reliability performance for T/LQFP packages.


Applications Molding Compounds > Semiconductor Molding Compounds
Chemistry Epoxies
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Loctite Hysol KL G750 'Epoxy molding compound'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1085678 1085678 Hysol Huawei KL-G750 13X4 10kg Ctn