Hysol Huawei KLG750
Hysol HuaweiKLG750 has superior adhesion technology to ensure zero delamination performance for SOT and SOIC packages. Offers enhanced reliability performance for T/LQFP packages.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds |
| Chemistry |
Epoxies |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1085678 | 1085678 | Hysol Huawei KL-G750 13X4 10kg Ctn |
|
