Hysol KL-4500-1
Hysol® KL-4500-1™ is a low stress and high reliability molding compound suitable for TO, SOIC ,SSOP and QFP packages, providing high purity and low uranium content. It’s low viscosity properties enables low wire sweep molding with a large operating window.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds Molding Compounds > Semiconductor Molding Compounds > Through-Hole Discretes |
| RoHS Compliant | Contact Henkel |
