Hysol KL-4500-1N
Hysol® KL-4500-1N™ is a low stress and high reliability molding compound suitable for TO, SOP and SSOP packages. KL-4500- 1N meets JEDEC Level 2/260C for DIP and SOP. It’s low viscosity properties enables low wire sweep molding with a large operating window.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds Molding Compounds > PCB Molding Compounds |
| RoHS Compliant | Contact Henkel |
