Hysol KL-4500-1NT

Hysol KL-4500-1NT is a low stress and high reliability molding compound suitable for SOIC packages. Its low viscosity properties enable low wire sweep molding with a large operating window.


Applications Molding Compounds > Semiconductor Molding Compounds > Surface Mount / Lead Frames
Molding Compounds > PCB Molding Compounds
Chemistry Epoxies
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Loctite Hysol KL 4500-1NT 'Heat cure epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1074520 100-148 Hysol KL-4500-1NT 16+7.7 10kg Ctn
 
1074384 100-3 Hysol KL-4500-1NT 55 90 JSCD 15kg Ctn
 
1080084 1080084 Hysol Huawei KL-4500-1NT 13+3.6 10kg Ctn
 
1080085 1080085 Hysol KL-4500-1NT 13+3.5 10kg TSHT
 
1089110 1089110 Hysol Huawei KL-4500-1NT 14X6.1 10kg Ctn
 
1089121 1089121 Hysol KL-4500-1NT Huawei 16X9.5 10kg Ctn
 
1090041 1090041 Hysol KL-4500-1NT Huawei 16X8.5 10kg Ctn
 
1117850 1117850 Hysol KL-4500-1NT Huawei 16X8.2 10kg Ctn
10.0 carton  
1119854 1119854 Hysol KL-4500-1NT 13X3.2 10kg Ctn
 
1139667 1139667 Hysol KL-4500-1NT 58X65 15kg Ctn
 
1040661 21166 Hysol KL-4500-1NT 55mmx75g 15kg Ctn
 
1040856 29404 Hysol KL-4500-1NT 14mmx3.5g 10kg Ctn
 
1041245 40785 Hysol KL-4500-1NT 13mmx4.5g 10kg Ctn