Hysol KL-5000-HT
Hysol KL-5000-HT has alumina fillers and delivers a high thermal conductive solution for TO-220F/3PF's thermal requirements. KL5000-HT's low moisture absorption and low thermal expansion is suitable for stress sensitive devices.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Through-Hole Discretes, High Thermal Conductivity Molding Compounds > Semiconductor Molding Compounds > Non-Green Molding Compounds |
| Chemistry |
Epoxies |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1092747 | 1092747 | Hysol Huawei KL-5000-HT 43X68 15kg Ctn |
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| 1095548 | 1095548 | Hysol Huawei KL-5000-HT 43X69 15kg Ctn |
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| 1124155 | 1124155 | Hysol Huawei KL-5000-HT 43X60 15kg Ctn |
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| 1146323 | 1146323 | Hysol Huawei KL-5000-HT 43X75 15kg Ctn |
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| 1167565 | 1167565 | Hysol Huawei KL-5000-HT 48X80 15kg Ctn |
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| 1461615 | 1461615 | HYSOL KL-5000-HT |
15.0 carton
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| 1040632 | 19204 | Hysol Huawei KL-5000-HT 55mmx100g 15kg Ctn |
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| 1040633 | 19205 | Hysol Huawei KL-5000-HT 48mmx85g 15kg Ctn |
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| 1041253 | 41104 | Hysol Huawei KL-5000-HT 48mmx82g 15kg Ctn |
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