Hysol KL-6500S

Hysol KL-6500S is a low stress molding compound suitable for SOT/SMX and SOD packages. Hysol Huawei KL6500S provides good workability and high reliability.


Applications Molding Compounds > Semiconductor Molding Compounds
Molding Compounds > Semiconductor Molding Compounds > Surface Mount / Lead Frames
Chemistry Epoxies
RoHS Compliant Contact Henkel
Product Note Contact Customer Service for ordering information.

Technical Data Sheets (TDS)

Loctite Hysol KL 6500S 'Epoxy molding compound'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1041084 1041084 HYSOL KL-6500S
15.0 carton