HYSOL KL-7000HA
HYSOL KL-7000HA is suitable for SOT, SSOP and QFP packages. Provides ultra low stress, low moisture absorption, high purity and high reliability. Its low viscosity properties enable low wire sweep.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds Molding Compounds > Semiconductor Molding Compounds > Surface Mount / Lead Frames Molding Compounds > Semiconductor Molding Compounds > Non-Green Molding Compounds |
| Chemistry |
Epoxies |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1102891 | 1102891 | HYSOL KL-7000HA 13 x 4.1 |
10.0 carton
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| 1110519 | 1110519 | Hysol KL-7000HA 16X6.6 10kg Ctn |
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| 1149053 | 1149053 | Hysol KL-7000HA 48X90 15kg Ctn |
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| 1168797 | 1168797 | Hysol KL-7000HA #GEM# 16X8.5 15kg |
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| 1124862 | KL-7000HA | Hysol KL-7000HA 14X4.7 10kg Ctn |
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