Hysol® KL-G45OH™ is a low stress, green mold compound suitable for SOP, SOJ and QFP and contains no bromine, antimony or phosphorus flame retardant. KL-G450H has a low stress flexible resin system offering high reliability and meeting JEDEC Level 3/260C for a QFP package.
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PCB Molding Compounds
Molding Compounds > Semiconductor Molding Compounds > Surface Mount / Lead Frames
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