Hysol KL-G500HT

High thermal conductivity, for TO-220F/3PF packages.


Applications Molding Compounds > Semiconductor Molding Compounds > Through-Hole Discretes, High Thermal Conductivity
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Loctite Hysol KL G500HT 'Epoxy molding compound'
PDF

Product information

IDH# Item Name Size
Case Quantity		 Material Safety Data Sheets
kl-g500ht_idh kl-g500ht Hysol KL-G500HT
 


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