Hysol KL-G730
HYSOL KL-G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol KL-G730 offers enhanced reliability peformance for T/LQFP packages. KL-G730 meets UL 94 V-0 flammability at 3.175mm thickness.
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Surface Mount / Lead Frames Molding Compounds > PCB Molding Compounds Molding Compounds > Semiconductor Molding Compounds > Green Molding Compounds |
| Chemistry |
Epoxies |
| Media Carrier | 100 % solid (incl. Hot Melt) |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1255005 | 1255005 | Hysol KL-G730 16X10 15kg C |
15.0 carton
|
