Hysol KL-G730

HYSOL KL-G730 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. Hysol KL-G730 offers enhanced reliability peformance for T/LQFP packages. KL-G730 meets UL 94 V-0 flammability at 3.175mm thickness.


Applications Molding Compounds > Semiconductor Molding Compounds > Surface Mount / Lead Frames
Molding Compounds > PCB Molding Compounds
Molding Compounds > Semiconductor Molding Compounds > Green Molding Compounds
Chemistry Epoxies
Media Carrier 100 % solid (incl. Hot Melt)
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Loctite Hysol KL G730 'Epoxy molding compound'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1255005 0000001255005 Hysol KL-G730 16X10 15kg C
15.0 carton