Hysol KL-G900HC
Epoxy molding compound contains no bromine, antimony or phosphorus flame retardant. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature. Meets UL 94 V-0 Flammability at 3.175mm thickness. (QFN)
| Applications |
Molding Compounds >
Semiconductor Molding Compounds >
Surface Mount / Lead Frames Molding Compounds > Semiconductor Molding Compounds > Green Molding Compounds |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| kl-g900hc_idh | kl-g900hc | Hysol KL-G900HC |
|
