Hysol KL1000-3LX

Hysol Huawei KL-1000-3LX provides the lowest cost of ownership with superior moldability and reliability. KL1000-3LX is extremely suitable for bridge, axial and TO packages.


Applications Molding Compounds > Semiconductor Molding Compounds > Through-Hole Discretes
Molding Compounds > Semiconductor Molding Compounds > Non-Green Molding Compounds
Chemistry Epoxies
RoHS Compliant Contact Henkel
Product Note Contact Customer Service for ordering information.

Technical Data Sheets (TDS)

Loctite Hysol KL 1000-3LX 'Heat cure epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1040349 1040349 HYSOL KL-1000-3LX
15.0 carton