Hysol QMI 3555R

Hysol QMI 3555R is a no-dry Ag/glass die attach for glass, solder and seamed sealed packages. Very high thermal conductivity with a 450°C temperature resistance for glass-sealed hermetic packages.


Applications Adhesives > Die Attach Adhesives
Adhesives > Die Attach Adhesives, Electrically Conductive
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Loctite Hysol QMI 3555R 'Conductive Silver Glass Adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
452148 452148 Hysol QMI3555R
 
973925 973925 QMI® 2569™