Hysol QMI 3555R
Hysol QMI 3555R is a no-dry Ag/glass die attach for glass, solder and seamed sealed packages. Very high thermal conductivity with a 450°C temperature resistance for glass-sealed hermetic packages.
| Applications |
Adhesives >
Die Attach Adhesives Adhesives > Die Attach Adhesives, Electrically Conductive |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 452148 | 452148 | Hysol QMI3555R |
|
|
| 973925 | 973925 | QMI® 2569™ |
|
