Hysol QMI516LC
Hysol QMI516LC is a low temperature cure, silver-filled adhesive.
| Applications |
Adhesives >
Electrically Conductive Adhesives >
Heat Cure |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1076322 | 1076322 | Hysol QMI516LC 30cc EFD |
|
|
| 1076323 | 1076323 | Hysol QMI516LC 10cc EFD |
|
