Hysol QMI516LC

Hysol QMI516LC is a low temperature cure, silver-filled adhesive.


Applications Adhesives > Electrically Conductive Adhesives > Heat Cure
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol QMI 516LC 'Die Attach Paste'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1076322 1076322 Hysol QMI516LC 30cc EFD
 
1076323 1076323 Hysol QMI516LC 10cc EFD