Hysol QMI519

Hysol QMI519 is JEDEC L1 260°C for SOIC, industry standard for QFN packages. Industry standard for preplated finishes. Exceptional performance on clean uncoated silver-plated finishes. High adhesion, excellent electrical and thermal performance.


Applications Adhesives > Die Attach Adhesives
Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste
Adhesives > Die Attach Adhesives, Electrically Conductive
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol QMI 519 'Conductive Adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1123472 1123472 Hysol QMI519 5DLT 10cc EFD
10.0 cc  
1511748 1511748 ABLESTIK QMI519
19.0 g