Hysol QMI519
Hysol QMI519 is JEDEC L1 260°C for SOIC, industry standard for QFN packages. Industry standard for preplated finishes. Exceptional performance on clean uncoated silver-plated finishes. High adhesion, excellent electrical and thermal performance.
| Applications |
Adhesives >
Die Attach Adhesives Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste Adhesives > Die Attach Adhesives, Electrically Conductive |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1123472 | 1123472 | Hysol QMI519 5DLT 10cc EFD |
10.0 cc
|
|
| 1511748 | 1511748 | ABLESTIK QMI519 |
19.0 g
|
