Highly silver filled, conductive adhesive designed to provide high (6-7 W/m°K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to metallic leadframes. The material is hydrophobic and stable at high temperatures.
Thermally Conductive Adhesives >
Thermally Conductive Paste
Adhesives > Electrically Conductive Adhesives > Heat Cure
Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)