Hysol QMI529HT
Highly silver filled, conductive adhesive designed to provide high (6-7 W/m°K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to metallic leadframes. The material is hydrophobic and stable at high temperatures.
| Applications |
Adhesives >
Thermally Conductive Adhesives >
Thermally Conductive Paste Adhesives > Electrically Conductive Adhesives > Heat Cure Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste |
| Chemistry |
Epoxy based |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 610821 | qmi529ht | Hysol QMI529HT |
|
