Hysol QMI529HT

Highly silver filled, conductive adhesive designed to provide high (6-7 W/m°K) thermal conductivity and excellent electrical conductivity for attachment of integrated circuits and components to metallic leadframes. The material is hydrophobic and stable at high temperatures.


Applications Adhesives > Thermally Conductive Adhesives > Thermally Conductive Paste
Adhesives > Electrically Conductive Adhesives > Heat Cure
Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol QMI 529HT 'Silver Filled Conductive Adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
610821 qmi529ht Hysol QMI529HT