Hysol QMI536NB

Hysol QMI536NB has high JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.

Applications Adhesives > Die Attach Adhesives
Adhesives > Die Attach Adhesives, Electrically Non-Conductive
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Hysol Hysol QMI 536NB 'Non-Electrically Conductive Adhesive'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1017517 1017517 Hysol QMI536NB 30cc MUSHASHI KIT 41.10g
1073362 1073362 Hysol QMI536NB 5cc EFD 6.3g
1114940 1114940 Hysol QMI536NB 5cc KYT 6.3 GM
1123457 1123457 Hysol QMI536NB 5DLT 10cc EFD
982024 982024 Hysol QMI536NB 10cc MUSASHI 13.70g
982027 982027 Hysol QMI536NB 10cc EFD White Piston 13.70g
982028 982028 Hysol QMI536NB 30cc EFD EHT PST 41.10g