Hysol QMI536NB
Hysol QMI536NB has high JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
| Applications |
Adhesives >
Die Attach Adhesives Adhesives > Die Attach Adhesives, Electrically Non-Conductive |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1017517 | 1017517 | Hysol QMI536NB 30cc MUSHASHI KIT 41.10g |
|
|
| 1073362 | 1073362 | Hysol QMI536NB 5cc EFD 6.3g |
|
|
| 1114940 | 1114940 | Hysol QMI536NB 5cc KYT 6.3 GM |
|
|
| 1123457 | 1123457 | Hysol QMI536NB 5DLT 10cc EFD |
|
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| 982024 | 982024 | Hysol QMI536NB 10cc MUSASHI 13.70g |
|
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| 982027 | 982027 | Hysol QMI536NB 10cc EFD White Piston 13.70g |
|
|
| 982028 | 982028 | Hysol QMI536NB 30cc EFD EHT PST 41.10g |
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