Hysol QMI536NB-1A3

High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.


Applications Adhesives > Die Attach Adhesives
Adhesives > Die Attach Adhesives, Electrically Non-Conductive
Chemistry Bismaleimide
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1010400 1010400 Hysol QMI536NB-1A3 10CC EFD WH