Hysol QMI536NB-1A3
High JEDEC performance for first die and die-to-die bonding. Non-conductive and non-damaging to the die face. Can be cured as low as 80°c. No bleed.
| Applications |
Adhesives >
Die Attach Adhesives Adhesives > Die Attach Adhesives, Electrically Non-Conductive |
| Chemistry |
Bismaleimide |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
| IDH# | Item | Name | Size |
|
| 1010400 | 1010400 | Hysol QMI536NB-1A3 10CC EFD WH |
|
