Hysol SB-50

Hysol SB-50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is ideal for large packages where underfill flow is challenging.


Applications Adhesives > Underfills > Reworkable CSP Underfill, Other
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol SB-50 'Underfill'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189058 1189058 Hysol SB-50 30 GR/ 30CC SYR
 
1189059 1189059 Hysol SB-50 180 GR 6 OZ CART
 
1246512 1246512 Hysol SB-50 55 GRAMS 55CC SYRINGE