Hysol SB-50
Hysol SB-50 underfill material is ideal for high volume assembly processes. As the product does not flow under the solder array, it is ideal for large packages where underfill flow is challenging.
| Applications |
Adhesives >
Underfills >
Reworkable CSP Underfill, Other |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1189058 | 1189058 | Hysol SB-50 30 GR/ 30CC SYR |
|
|
| 1189059 | 1189059 | Hysol SB-50 180 GR 6 OZ CART |
|
|
| 1246512 | 1246512 | Hysol SB-50 55 GRAMS 55CC SYRINGE |
|
