Hysol STYCAST 50500-1

For protection of wire-bonded ICS, consider this flowable material for a fill.


Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Potting & Encapsulating > Glob Top Materials > Glob Top Materials - Chip-on-Board
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Stycast 50500-1 'Heat cure epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189615 1189615 Hysol STYCAST 50500-1 500
 
1189617 1189617 Stycast 50500-1 40 G
 
1189618 1189618 Hysol STYCAST 50500-1 30C
 
1289346 1289346 Stycast 50500-1 40GM/30CC SYRIN