Hysol STYCAST 50500-1
For protection of wire-bonded ICS, consider this flowable material for a fill.
| Applications |
Potting & Encapsulating >
Fill Materials >
Fill Materials - Chip-on-Board Potting & Encapsulating > Glob Top Materials > Glob Top Materials - Chip-on-Board |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1189615 | 1189615 | Hysol STYCAST 50500-1 500 |
|
|
| 1189617 | 1189617 | Stycast 50500-1 40 G |
|
|
| 1189618 | 1189618 | Hysol STYCAST 50500-1 30C |
|
|
| 1289346 | 1289346 | Stycast 50500-1 40GM/30CC SYRIN |
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