Hysol TRA-BOND 2115
Clear, low viscosity epoxy formulation used in the fabrication of lasers. It is capable of withstanding 30 seconds of 60 watt direct laser energy. The low cure shrinkage (using a room temperature cure) makes Tra-Bond 2115 an excellent choice for bonding optical components where alignment accuracy is essential. It has been used in cycling applications down to 4K.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives Adhesives > Electrically Non-Conductive Adhesives > Cure Type |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
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| 1188359 | 1188359 | Hysol TRA-BOND 2115 BIPAX |
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| 1188452 | 1188452 | Hysol TRA-BOND 2115 BIPAX 7 GR |
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| 1188508 | 1188508 | Hysol TRA-BOND 2115 BIPAX 28 GR |
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| 1205554 | 1205554 | Hysol TRA-BOND 2115 BIPAX 2.5 GRAM |
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| 1205573 | 1205573 | Hysol TRA-BOND 2115 BIPAX 7 GRAM |
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