Hysol TRA-BOND F112
Long pot life, impact resistant, fiber-optic adhesive. This two-part, low viscosity epoxy paste adhesive has the distinct advantage of remaining below 3000 cP's for a minimum of 40 minutes. Sufficient cure is developed for polishing connectors in 15 minutes at 65°C.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188409 | 1188409 | Hysol TRA-BOND F112 BIPAX |
|
|
| 1205335 | 1205335 | Hysol TRA-BOND F112 2.5G |
|
