Hysol TRA-BOND F113SC
Room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber-optic connectors. Tra-Bond F113SC provides high bond strength & low stress connections with no pistoning.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives >
Cure Type |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188411 | 1188411 | Hysol TRA-BOND F113SC BIPAX 2.5 GR |
|
|
| 1188523 | 1188523 | Hysol TRA-BOND F113SC BIPAX 28 GR |
|
|
| 1188537 | 1188537 | Hysol TRA-BOND F113SC MPX 6 PK (1 GR) |
|
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| 1205337 | 1205337 | Hysol TRA-BOND F113SC 2.5G |
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| 1205341 | 1205341 | Hysol TRA-BOND F113SC 7.0G/BIPAX |
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| 1205343 | 1205343 | Hysol TRA-BOND F113SC 6G |
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| 1205585 | 1205585 | Hysol TRA-BOND F113SC BIPAX 28 GRAM |
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