Hysol TRA-BOND F113SC

Room temperature curing, high Tg and low viscosity adhesive formulated for terminating ALL TYPES of fiber-optic connectors. Tra-Bond F113SC provides high bond strength & low stress connections with no pistoning.


Applications Adhesives > Electrically Non-Conductive Adhesives > Cure Type
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol Tra-Bond F113SC 'Epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1188411 1188411 Hysol TRA-BOND F113SC BIPAX 2.5 GR
 
1188523 1188523 Hysol TRA-BOND F113SC BIPAX 28 GR
 
1188537 1188537 Hysol TRA-BOND F113SC MPX 6 PK (1 GR)
 
1205337 1205337 Hysol TRA-BOND F113SC 2.5G
 
1205341 1205341 Hysol TRA-BOND F113SC 7.0G/BIPAX
 
1205343 1205343 Hysol TRA-BOND F113SC 6G
 
1205585 1205585 Hysol TRA-BOND F113SC BIPAX 28 GRAM