Hysol TRA-BOND FDA16
A medium viscosity epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI approval.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives >
Cure Type |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188429 | 1188429 | Hysol TRA-BOND FDA16 BIPAX 2.4 GR |
|
