Hysol TRA-BOND FDA16
A medium viscosity epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI approval.
Electrically Non-Conductive Adhesives >
|Media Carrier||100 % liquid & paste|
|Cure Type||Heat cure|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)
|1188429||1188429||Hysol TRA-BOND FDA16 BIPAX 2.4 GR||