Hysol TRA-BOND FDA2
A thixotropic epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI approval.
| Applications |
Adhesives >
Electrically Non-Conductive Adhesives >
Cure Type |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1188430 | 1188430 | Hysol TRA-BOND FDA2 BIPAX 2.2 GR |
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| 1188500 | 1188500 | Hysol TRA-BOND FDA2 BIPAX |
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| 1188528 | 1188528 | Hysol TRA-BOND FDA2 BIPAX 25 GR |
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| 1188540 | 1188540 | Hysol TRA-BOND FDA2 MPX 6 PK (1 GR) |
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| 1189093 | 1189093 | Hysol TRA-BOND FDA2 TRA-PAX 50 CC W/MIXER |
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| 1189099 | 1189099 | Hysol TRA-BOND FDA2 TRA-PAX 50 CC W |
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| 1205564 | 1205564 | Hysol TRA-BOND FDA2 BIPAX 2.2 GRAM |
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