Hysol TRA-DUCT 2902

Silver-filled epoxy recommended for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. This two-part, smooth paste formulation of refined pure silver and epoxy is free of solvents, copper and carbon additives. Tra-Duct 2902 cures at room temperature and can be used as a cold solder for heat-sensitive components where hot soldering is impractical. This adhesive complies with the requirements of NASA's Outgassing Specification.

Technical Information

Applications	Adhesives > Electrically Conductive Adhesives > Two Component
Chemistry	Epoxies
Media Carrier	100 % liquid & paste
Cure Type	Heat cure
RoHS Compliant	Contact Henkel

Technical Data Sheets (TDS)

Hysol Tra-duct 2902 'Electronic bonding & sealing applications'

PDF

English

Product information

IDH#	Item	Name	Size Case Quantity	Material Safety Data Sheets
1188384	1188384	Hysol TRA-DUCT 2902 BIPAX 2.65 GR		1446215 (us/en; 1 of 4) 1446210 (us/en; 2 of 4) 1382564 (us/en; 3 of 4) 1382565 (us/en; 4 of 4)
1188476	1188476	Hysol TRA-DUCT 2902 BIPAX(S)		1446211 (us/en; 1 of 4) 1382566 (us/en; 2 of 4) 1382567 (us/en; 3 of 4) 1446217 (us/en; 4 of 4)
1188517	1188517	Hysol TRA-DUCT 2902 BIPAX 20 GR		1446214 (us/en; 1 of 2) 1446212 (us/en; 2 of 2)
1188576	1188576	Hysol TRA-DUCT 2902 CUS BIPAX 2.65 GR
1188637	1188637	Hysol TRA-DUCT 2902 LB BULK KIT, HARD
1188638	1188638	Hysol TRA-DUCT 2902 LB BULK KIT, RESI
1205411	1205411	Hysol TRA-DUCT 2902

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