Hysol UF3537

Hysol UF3537 underfill is designed to improve board level assembly reliability.


Applications Adhesives > Electrically Insulating Adhesives
Adhesives > Underfills > Non-Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxy based
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol UF3537 'Underfill material'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1580345 1580345 Hysol UF3537
55.0 cc syringe