Hysol UF3537
Hysol UF3537 underfill is designed to improve board level assembly reliability.
| Applications |
Adhesives >
Electrically Insulating Adhesives Adhesives > Underfills > Non-Reworkable CSP Underfill, Capillary Flow |
| Chemistry |
Epoxy based |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1580345 | 1580345 | Hysol UF3537 |
55.0 cc
syringe
|
