Hysol UF8830

Hysol UF8830 is a liquid epoxy underfill encapsulant designed for flip chip BGA applications requiring improved crack/fracture resistance and low warpage.


Applications Adhesives > Underfills > Pb-Free Packages Capillary
Adhesives > Underfills > Over-Molded Flip-Chip Capillary
Adhesives > Underfills > Flip-Chip on Flex Capillary
Adhesives > Underfills > Non-Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol UF8830 'Liquid epoxy underfill '
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1500114 1500114 Hysol UF8830
10.0 cc syringe