Hysol US5532
Encapsulant potting urethane.
| Applications |
Potting & Encapsulating >
PCB Protection Encapsulants - Potting >
Urethane Encapsulants-Potting, Two Component |
| Chemistry |
Polyurethane |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 500738 | 500738 | Hysol US5532 PART A |
|
|
| 500892 | 500892 | Hysol US5532 PART B |
|
