Hysol UV8800M

UV cure encapsulant for smart card and other COB applications.


Applications Potting & Encapsulating > Fill Materials > Fill Materials - Chip-on-Board
Chemistry Epoxy based
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol UV8800M 'Epoxy encapsulant'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1228111 uv8800m Hysol UV8800M