Hysol XUV-9052

HYSOL XUV-9052 is a one component, dual cure (UV & moisture) adhesive designed as a lead encapsulant used in ink jet applications.


Applications Potting & Encapsulating > Dam Materials
Potting & Encapsulating > Glob Top Materials > Glob Top Materials, UV Cure
Potting & Encapsulating > Glob Top Materials > Glob Top Materials - Chip-on-Board
Chemistry Polyacrylates
Media Carrier 100 % liquid & paste
Cure Type UV and light cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol XUV-9052 'uv/light cure adhesive'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1189203 1189203 Hysol ECCOBOND UV9052 55 GM /55 CC BLACK BAR