LOCTITE 3517

LOCTITE 3517 is a one part, heat curable epoxy. It is designed for use as a reworkable CSP (FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices.


Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Loctite Loctite 3517 'Epoxy underfill'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
839286 40987 LOCTITE 3517 CSP Underfill 30cc EFD
syringe
10 / case