Loctite 3536
Loctite 3536 is a CSP/BGA reworkable underfill designed to cure rapidly at low temperatures. Once cured, it provides excellent protection for solder joints against mechanical stress such as shock, drop and vibration.
| Applications |
Adhesives >
Underfills >
Reworkable CSP Underfill, Capillary Flow |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1061021 | 1061021 | Loctite 3536 CSP Underfill 20 oz EFD |
|
|
| 1061022 | 1061022 | Loctite 3536 CSP Underfill 10cc EFD 11.g |
|
|
| 1061023 | 1061023 | Loctite 3536 CSP Underfill 6 oz. 195.g |
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