LOCTITE 3536 is a CSP/BGA reworkable underfill designed to cure rapidly at low temperatures. Once cured, it provides excellent protection for solder joints against mechanical stress such as shock, drop and vibration.

Applications Adhesives > Underfills > Reworkable CSP Underfill, Capillary Flow
Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Loctite Loctite 3536 'reworkable underfill'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1061021 0000001061021 Loctite 3536 CSP Underfill 20 oz EFD
1061022 0000001061022 Loctite 3536 CSP Underfill 10cc EFD 11.g
1061023 0000001061023 Loctite 3536 CSP Underfill 6 oz. 195.g