LOCTITE 3548 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved process time.

Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
910483 910483 LOCTITE 3548 CSP Underfill 10cc EDF 12.5 g
973565 973565 LOCTITE 3548
(LOCTITE 3548)