LOCTITE 3549 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved process time.

Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Loctite Loctite 3549 'Fast Flow, Low Temperature Cure, Reworkable Epoxy Underfill'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
910487 910487 LOCTITE 3549 CSP Underfill 30cc EFD
910488 910488 LOCTITE 3549 CSP Underfill 10cc EFD 12.5g
973566 973566 LOCTITE 3549
(LOCTITE 3549)