Loctite 3549
Loctite 3549 is a next generation reworkable underfill for thermal and mechanical reliability. Designed to snap cure at low temperature to minimize thermal stress on PCB's. Fast flow for improved process time.
- Technical Information
- Case Histories
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 910487 | 910487 | Loctite 3549 CSP Underfill 30cc EFD |
|
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| 910488 | 910488 | Loctite 3549 CSP Underfill 10cc EFD 12.5g |
|
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| 973566 | 973566 | Loctite® 3549™ |
|
