LOCTITE 3551

LOCTITE 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.


Chemistry Epoxies
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant yes

Technical Data Sheets (TDS)

Loctite Loctite 3551 'Heat Cure Epoxy'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
730284 40385 LOCTITE 3551 CSP Underfill 250 ml