Loctite 3551
Loctite 3551 is a one component heat cure epoxy designed for use as board level underfill for IC packages such as CSP's and BGA's.
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 730284 | 40385 | Loctite 3551 CSP Underfill 250 ml |
|
