Loctite 3563
Rapid curing fast flowing liquid epoxy for use as a capillary flow underfill for packaged IC's
| Applications |
Adhesives >
Underfills >
Reworkable CSP Underfill, Capillary Flow |
| Chemistry |
Epoxies |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | yes |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 144828 | 144828 | Loctite 3563 SNAP CURE UNDER |
|
