MULTICORE MP200

MULTICORE MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both air and nitrogen.  It has been formulated to have increased reflow operating window.  Soft residues make pin testing easier eliminating any need for cleaning.  Resistant to both hot and cold slump. 63S4 alloy offers an instant solution where tombstoning is a particular process problem.


Applications Solder Materials > Solder Paste
Chemistry Sn/Pb
Media Carrier 100 % liquid & paste
Cure Type n/a
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Multicore Multicore MP200 'No-Clean Solder Paste for High Speed Printing'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
483842 483842 MULTICORE MP200
1.3 gm