MULTICORE MP200 solder pastes have been formulated as no-clean, Sn/Pb solder paste for high speed printing and reflow in both air and nitrogen. It has been formulated to have increased reflow operating window. Soft residues make pin testing easier eliminating any need for cleaning. Resistant to both hot and cold slump. 63S4 alloy offers an instant solution where tombstoning is a particular process problem.
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|Media Carrier||100 % liquid & paste|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)