Macromelt MM 6208S
Moldable polyamide with excellent adhesion to tough substrates. Great flexibility with incredible strain relief on cables and wires. Ideal for encapsulation of heat producing components in appliance and consumer electronics.
| Applications |
Molding Compounds >
Low Pressure Molding Compounds >
Polyamide Low Pressure Molding Compounds |
| Chemistry |
Polyamide |
| Media Carrier | 100 % solid (incl. Hot Melt) |
| Cure Type | non-reactive |
| RoHS Compliant | yes |
