Multicore DA101

Flux designed for solder die attach paste applications.  Effective thermal control for Cu leadframe power semiconductor devices, such as rectifiers, power transistors, and for automorive and consumer packages.

Applications Adhesives > Die Attach Adhesives, Electrically Conductive
Solder Materials > Solder Paste > Die Attach Solder Paste
Chemistry Solvent flux chemistry
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Multicore® Multicore® DA101 'Printing Grade Solder Paste'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
da101_idh da101 Multicore DA101

Additional Documents

Achieving Thermal Control for Power Devices: Die Attach Solder Pastes for Varying Requirements
Henkel Extends Die Attach Solder Paste Product Line, Adds Printable Formula to Popular Portfolio