Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding

MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes including Ni/Au, immersion Sn, Immersion Ag and OSP Cu. Proflow compatible. Available with both AGS (20-45?m, equivalent to IPC type 3) and DAP (20-38?m, equivalent to IPC type 4) powder.


Applications Solder Materials > Solder Paste
Chemistry Pb-free
Media Carrier 100 % liquid & paste
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Multicore Multicore LF328 'Lead-Free Solder Paste'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
890403 890403 Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding 97SC AGS 88.5 500 g Jar MB711
 
890406 890406 Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding 97SC AGS 88.5 600 g Semco MB711