Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding
MulticoreLF328 is a halide-free no-clean Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Offers high tack to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and N2 reflow ovens and across a wide range of surface finishes including Ni/Au, immersion Sn, Immersion Ag and OSP Cu. Proflow compatible. Available with both AGS (20-45?m, equivalent to IPC type 3) and DAP (20-38?m, equivalent to IPC type 4) powder.
Solder Materials >
|Media Carrier||100 % liquid & paste|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)
|890403||890403||Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding 97SC AGS 88.5 500 g Jar MB711||
|890406||890406||Multicore LF328 No-Clean Solder Paste: Lead-Free Ultra Low Voiding 97SC AGS 88.5 600 g Semco MB711||