Multicore LF600 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5V)
Multicore LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability; it is capable of being print cycled on 0.5 mm pitch CSP apertures for 24 hours in conditions of 33C/75%RH. LF600 also shows almost zero hot slump, reducing the likelihood of bridging and mid-chip solder balling. It has > 4 hours abandon time and is available in both type 3 and type 4 powder Proflow compatible.
Solder Materials >
|Media Carrier||100 % liquid & paste|
|RoHS Compliant||Contact Henkel|
Technical Data Sheets (TDS)
|1146652||1146652||Multicore LF600 No-Clean Solder Paste: Lead-Free 97SC AGS88.5V AFU 500g Jar||