Multicore LF600 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5V)

Multicore LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability; it is capable of being print cycled on 0.5 mm pitch CSP apertures for 24 hours in conditions of 33C/75%RH. LF600 also shows almost zero hot slump, reducing the likelihood of bridging and mid-chip solder balling. It has > 4 hours abandon time and is available in both type 3 and type 4 powder Proflow compatible.


Applications Solder Materials > Solder Paste
Chemistry Pb-free
Media Carrier 100 % liquid & paste
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Multicore Multicore LF600 'Low voiding, zero hot slump solder paste'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1146652 1146652 Multicore LF600 No-Clean Solder Paste: Lead-Free 97SC AGS88.5V AFU 500g Jar