Multicore LF600 No-Clean Solder Paste: Lead-Free (97SC AGS 88.5V)
Multicore LF600 is a halide-free, no-clean, solder paste that exhibits excellent thermal stability; it is capable of being print cycled on 0.5 mm pitch CSP apertures for 24 hours in conditions of 33C/75%RH. LF600 also shows almost zero hot slump, reducing the likelihood of bridging and mid-chip solder balling. It has > 4 hours abandon time and is available in both type 3 and type 4 powder Proflow compatible.
| Applications |
Solder Materials >
Solder Paste |
| Chemistry |
Pb-free |
| Media Carrier | 100 % liquid & paste |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1146652 | 1146652 | Multicore LF600 No-Clean Solder Paste: Lead-Free 97SC AGS88.5V AFU 500g Jar |
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