Multicore TFN600

Tacky flux which provides excellent moisture and environmental protection for delicate circuitry in handheld devices.Non-Newtonian tacky flux designed for solder sphere attach in BGAs and CSPs. The rheology has been for diverse ball attach processes where the flux can be printed, dispensed or delivered by pin-transffer. Provides effective reliability in the attachment of Pb-free solder spheres to both Copper and gold / nickel based ubm packages.

Applications Solder Materials > Flux > Epoxy Flux
Chemistry Liquid flux chemistry
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Multicore Multicore TFN600 'Non-Newtonian tacky flux'

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
tfn600_idh tfn600 Multicore TFN600