Multicore TFN700B
Newtonian tacky flux designed for PoP applications. The rheology has been optimized to aid process consistency where mass flux transfer is paramount. The flux is ideally suited for dip-transfer process. Solderability of Pb-free components onto Cu and Ni-Au based substrates has been achieved.
| Applications |
Solder Materials >
Flux >
Epoxy Flux |
| Chemistry |
Liquid flux chemistry |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| tfn700b_idh | tfn700b | Multicore TFN700B |
|
