QMI529HT-LV2C1.5

Hysol QMI529HT-LV2C1.5 electrically conductive adhesive is designed for die attach applicaitons. It is recommended for use in the attachment integrated circuits and components onto metallic leadframes.

 


Applications Adhesives > Die Attach Adhesives, Electrically Conductive > Leaded Packages, Electrically Conductive Paste
Chemistry Bismaleimide
Media Carrier 100 % liquid & paste
Cure Type Heat cure
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol QMI529HT-LV2C1.5 '1.5 Spacer version of QMI529HT-LV2C'
PDF

Product information

IDH# Item Name Size
Case Quantity
Material Safety Data Sheets
1614457 1614457 HYSOL QMI529HT-LV 2C1.5
10.0 cc