QMI529HT-LV2C1.5
Hysol QMI529HT-LV2C1.5 electrically conductive adhesive is designed for die attach applicaitons. It is recommended for use in the attachment integrated circuits and components onto metallic leadframes.
| Applications |
Adhesives >
Die Attach Adhesives, Electrically Conductive >
Leaded Packages, Electrically Conductive Paste |
| Chemistry |
Bismaleimide |
| Media Carrier | 100 % liquid & paste |
| Cure Type | Heat cure |
| RoHS Compliant | Contact Henkel |
Technical Data Sheets (TDS)
Product information
| IDH# | Item | Name | Size |
|
| 1614457 | 1614457 | HYSOL QMI529HT-LV 2C1.5 |
10.0 cc
|
