HYSOL US1150 is an extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards. It exhibits very little hardness increase when cooled to -75ºC. It can be used for devices in the telecommunications and automotive industries. HYSOL US1150 meets UL 94V-0 rating. The 1 to 4 volume mix ratio makes meter-mix dispensing convenient.

Applications Potting & Encapsulating > PCB Protection Encapsulants - Potting > Urethane Encapsulants-Potting, Two Component
Chemistry Urethane
Media Carrier 100 % liquid & paste
Cure Type 2-Part reactive
RoHS Compliant Contact Henkel

Technical Data Sheets (TDS)

Hysol Hysol US1150 'Epoxy Casting System'