Handheld Communications & Computing

We offer innovative products optimized to provide the processibility needed for intricate handheld applications. The materials Snap Cure at low temperatures to keep pace with fast production cycle times and are highly stable, offering convenient storage, staging and use conditions. Henkel offers a wide range of underfills that improve the mechanical robustness of CSP, BGA, LGA and WLSP components in mobile phones and other handheld devices, as well as underfills that dramatically improve the thermal cycle reliability of Flip Chip assemblies.


Henkel designs and sells materials that improve the quality, robustness, mobile phones, MP3 players, game consoles, and a range of other handheld devices and associated products.

Adhesives Inks & Coatings Chip-on-Board (COB Encapsulants)

PCB Protection Solder Materials Thermal Management Materials