04/20/2010, Düsseldorf / Germany

 

New innovations from Henkel

 

Henkel product development expertise rewarded at APEX

Building on a rich history of industry honors and product accolades, Henkel Corporation was once again recognized for its innovation initiatives at the recent APEX event in Las Vegas, Nevada. Two of the company’s most recent product advances, Loctite PowerstrateXtreme Printable (PSX-P) and Hysol ECCOBOND CA3556HF, were at the top of the leaderboard for two well-established honors programs.

Loctite PSX-P was selected to take part in show organizer IPC’s Innovative Technology Center. One of seven elite ITC products, Loctite PSX-P was chosen by a panel of industry experts as a material that will provide real and relevant value to the electronics assembly supply chain. The material is a phase change thermal interface material that is deposited using traditional screen and stencil printing methodologies, thus automating the process and improving throughput. Loctite PSX-P is also production-friendly, as the extended dry version allows for a printer abandon time of two hours minimum. As an effective alternative to the pump out challenges of traditional greases and the application hurdles of very thin phase change pads, Loctite PSX-P moves thermal management into the next-generation. APEX attendees were able to learn of these and many other Loctite PSX-P benefits through a special display located in the lobby of the Mandalay Bay Convention Center.

For a breakthrough adhesive material called Hysol ECCOBOND CA3556HF, Henkel earned a Circuits Assembly NPI Award. The sole winner in the adhesives category, Hysol ECCOBOND CA3556HF was recognized as a leading new technology introduced during the last 12 months. A silver-filled electrically conductive adhesive designed to offer fast cure at low temperature, Hysol ECCOBOND CA3556HF is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates. The process advantages of the new material are many and, in addition to high peel strength, include stress minimization properties to compensate for CTE mismatches, fast cure for high throughput and a no-mix, one-part formula which reduces operator error and speeds processing time.

“We are honored to have been recognized for our unyielding process development and innovation efforts,” proudly states Doug Dixon, Henkel Global Marketing Director. “These honors underscore Henkel’s commitment to enabling customers’ processes by delivering more efficient, sustainable, high performance materials solutions and we are grateful to these organizations and the expert judges for their acknowledgement of our efforts.”

Henkel AG & Co. KGaA