11/5/2010, Düsseldorf

 

Henkel at the electronica 2010 trade fair

 
 
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Low-pressure injection molding with Macromelt hotmelt adhesives

The use of hotmelts for encapsulating electronic components is on the advance in virtually all sectors of industry. The hotmelt molding process reliably protects components – even those without plastic shells – from environmental effects and facilitates rapid and reliable processing. At the exhibition electronica 2010, Henkel is presenting an extensive range of Macromelt hotmelts for the most varied requirements.

The protection of electronic components by hotmelt molding is becoming increasingly established. Molding with hotmelts of the Macromelt brand has definite advantages over conventional methods in terms of application. Compared to classic plastics injection molding processes, processing takes place at a significantly lower injection pressure of 5-40 bar. The benefit of this is that even sensitive components can be readily encapsulated without being damaged. The advantage of Macromelt molding over 2K potting compounds is its much shorter cycle times of, in general, 10 to 50 seconds. In addition, since there is no longer any need for a separately produced shell, savings in production costs can be achieved in most cases despite the higher cost of the hotmelt adhesive.

Under the Macromelt brand, Henkel offers an extensive range of thermoplastic hotmelt adhesives, tailored in each case to the specific requirements. The Series 6 products are exciting not only technically but also environmentally, as they are produced from renewable resources. During their processing, no chemical reactions take place and no solvents are released. The most recent developments include Macromelt OM 671 with optimized cold flexibility. This universal product is intended for all electrical and electronic components (plugs, circuit boards, sensors, etc.) that have to be protected from external effects and are exposed to extreme temperature fluctuations. With service temperature range of -50°C to +140°C, Macromelt OM 671 displays exceptionally good low-temperature behavior.

In addition, Henkel’s portfolio also includes hotmelt solutions with specific properties for successful electronics encapsulation. Reliable protection outdoors is provided by Macromelt OM 648. Thanks to its high UV-stability, it is particularly suitable for applications with exposure to strong solar radiation and is used on the wiring of photovoltaic modules, for example. With another product, Macromelt OM 653, Henkel has achieved a significant improvement in hydrolysis resistance. Unlike standard hotmelt adhesives, the mechanical properties of this hotmelt change only slightly in contact with water. Macromelt OM 653 has successfully undergone the 85/85 test at a temperature of +85°C and humidity of 85% for 1,000 hours. For conventional hotmelts, this test often proves to be a stumbling-block, as it can permanently impair the adhesive’s mechanical properties. Macromelt OM 653, on the other hand, has almost unchanged values for tensile strength and elongation at break, even after drying.

Henkel also has a solution for the encapsulation of components that have to withstand the reflow process: Macromelt OM 730 even endures temperatures exceeding +200°C. Thanks to its one-component composition, it simplifies the production process considerably, as the plastic components used until now can be omitted. The temperature stability of Macromelt OM 730 also responds to the trend toward compact design in the automotive sector. With the electrics and electronics being shifted ever closer to the engine compartment, the shielding has to meet increasingly tough requirements.

Visitors can obtain further information on the latest product innovations at the Henkel stand (Hall B4, Stand 427) at electronica 2010.

Henkel AG & Co. KGaA