Henkel released its Ablestik C100 series conductive die attach films. Available in two formulations, – Ablestik C130 and Ablestik C115 supplied in 30 micron and 15 micron thicknesses, respectively – Henkel’s conductive die attach films now enable leadframe package manufacturers to realize the advantages film-based products have over traditional paste die attach products. Among the established benefits are the elimination of die tilt, the ability to process thinner die and facilitation of greater bondline control – all of which allow for improved processability, higher yields and better long-term reliability.

The development of Ablestik C100 die attach films is a huge leap forward for the leadframe package sector. Film simply provides incomparable process control and reliability- and now those advantages are no longer limited to non-conductive processes, but are available for applications that require conductive materials as well.

Ablestik C100 series film die attach materials also provide a high degree of manufacturing latitude, as their workability has been established on die sizes ranging from 1mm x 1mm up to 6mm x 6mm for a variety of package types including both QFNs and QFPs. In addition, the materials’ better wetting ability with lower bonding temperature provides extremely stable adhesion strength, allowing robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes.

As wafers continue to get thinner, leadframe packaging specialists will require die attach film alternatives to provide processing support and stability. Ablestik C100 materials deliver this essential process control element in combination with a bevy of other advantages.

Henkel AG & Co. KGaA